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Design Guidance for ThickFilm Circuit Substrates mode from Precious Metal.
カジノ シークレット 登録bstrates Made from Precious Metal: Design Guidance
| Items | Standards | |
|---|---|---|
| Substrate | Material | 96% Alumina |
| Substrate size | 50.4 mm × 50.4 mm to 129 mm × 116 mm (Note 1.) | |
| Long-length: 400 mm × 90 mm | ||
| External size tolerance | Standard: ±0.8% | |
| Minimum: ±0.3% | ||
| When using a laser scribe: ±0.075 mm | ||
| Substrate thickness | 0.635 mm, 0.8 mm, 1.0 mm (Note 2.) | |
| Substrate thickness tolerance | ±10% | |
| Warp tolerance | 80μm/inch | |
| Through-hole diameter | Minimum: 0.2 mm | |
| Through-hole spacing distance | Substrate thickness or greater | |
| Distance from through-holes to substrate edge | Substrate thickness or greater | |
| Conductor | Material/Conductor resistance | Silver (Ag): 2-3mΩ |
| Silver-palladium (Ag/Pd): 15–50 mΩ | ||
| Silver-platinum (Ag/Pt): 2–5 mΩ | ||
| Copper (Cu): 1-2 mΩ | ||
| Gold (Au): 2–4 mΩ | ||
| Platinum （Pt): 40 mΩ | ||
| Lines and spacing | Standard: 0.3/0.3 mm | |
| Minimum: 0.1/0.1 mm | ||
| Distance from conductor to substrate edge | ≧0.4 mm | |
| Through-hole land size | 1 mm for through-holes φ0.4 mm in diameter | |
| Resistors | Resistance | 10mΩ-10MΩ |
| Resistance tolerance | Standard: ±5% | |
| Minimum: ±0.1% (Note 3.) | ||
| Without trimming: ≥ ±30% | ||
| TCR | ±100 ppm/°C (Note 4.) | |
| Rated power | 310mW/mm2 (Ag/PtorAg/Pd) | |
| Minimum resistor size | Width: 0.6 mm | |
| Length: 0.6 mm | ||
| Residual width from trimming | 1/3 or more | |
| Width of overlap between resistors and conductors | 0.2mm | |
| Protective glass | Distance from glass to edge of substrate edge | ≧0.2mm |
| Distance from glass to conductor | ≧0.2mm | |
| Structure | - | Single layer, crossover, through-hole |
| Multi-layer structure | ||
Note 1: Please contact us for substrate sizes not listed above.
Note 2: Please contact us for substrate thicknesses not listed above.
Note 3: When 1% or less, please contact us for further details.
Note 4: Please contact us for further details.
