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Diamond Wire(Rejin bond,Electroplated)

Grinding and Polishing Tools

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Diamond wire consists of a piano wire core with affixed diamond grains. Diamond tools are used to slice all kinds of materials, such as silicon and sapphire. Using this diamond wire improves productivity compared to methods based on loose grain systems by improving machining efficiency and providing consistent machining precision. Since slurry isn’t required, diamond wire lets companies make significant reductions to their environmental impact.

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Rejin Bond

Resin bond diamond wire which enables a high precision, high grade slicing.

Electroplated

Electroplated diamond wire realizing high eficiency slicing.

Specifications

Type	Rejin Bond	Electroplated
Appearance
Structure
Product diameter	Ø150～320μm	Ø150～320μm
Core Wire diameter	Ø120～250μm	Ø120～250μm
Features	The fixed abrasive grain method enables high precision, high eficiency slicing. The stable slicing precision reduces decomposed layers when slicing.	Hard materials can be sliced with a high eficiency.
Applications	Slicing of silicon, magnetic materials, SiC, GaN, etc.	Slicing of silicon, sapphires, magnetic materials, SiC, GaN, etc.

Processing examples

Type	Rejin Bond	Electroplated
Work	Polycrystalline Silicon	Sapphire
Dimensions	□156mm	4inch

Product diameter	150μm	250μm
Core Wirediameter	120μm	180μm
Grain diameter	M12-25	M30-40

Wefar thickness	203μm
Thickness variation		24μm
TTV	13μm	8.4μm
Waviness	26μm
Warp		16～22μm
Surface roughness	0.3μm	0.27μm