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Beveling Wheel for Wafer

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Beveling Wheel and Notched Wheel for Silicon and Sapphire Wafers

Grinding wheel for bevel machining of semiconductor material substrates.
Thanks to a design featuring a uniform layer of fine grains and high-precision finishing technology, this grinding wheel makes high-quality, high-precision machining possible with minimal chipping.Both outer-circumference machining and notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.

Features

Even and ne diamond layer minimizes processing damage.
Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life.
Highly precise slotted shape and nishing technology support various wafer shapes.
Copper-less supported.

Standard Selection

Applications	Sapphire machining	Silicon machining
Applications	Sapphire machining	Emphasis on cutting	Standard	Emphasis on durability
Bond type	L-MSF	N-MB00	P-MB01	R-MB02

Case Study

		Beveling silicon wafers	Beveling sapphire wafers
Outer circumference machining	Wheel size	φ202×20T×19U×30H×3.7X	φ202×20T×19U×30H×3.7X
Outer circumference machining	Wheel specifications	SD800/1500 P - MB01	SD400 L - MSF
Notch machining	Wheel size	φ3.8×36L×11T×8U×1.4X	φ3.8×36L×11T×8U×1.4X
Notch machining	Wheel specifications	SD800/1500 P - MB01	SD400 L - MSFSD400 L - MSF